Circuits - Thin Film Ceramic:
Reinhardt Microtech
High volume production capability
Design and prototyping
High density interconnect substrates
"finebrid" LTCC and Thin Film combination
Microwave / mixed signal / digital / analogue
Fine Lines - 10 microns
Cu Filled vias
Pre-desposited AuSn solder
Air bridges
Printed resistors
Patterned Ferrite